Deciding between a multilayer PCB and a 3D PCB involves choosing between established planar density and innovative spatial integration. A multilayer Printed Circuit Board (PCB) is the best choice for complex, high-density electronic products with a conventional flat form factor, offering proven reliability and cost-effective scaling. In contrast, a 3D PCB, or 3D-Molded Interconnect Device (3D-MID), is ideal for products where space is minimal, the shape is non-conventional, and the electronic circuitry must be integrated directly onto the surface of a three-dimensional component, such as in wearables, medical implants, and advanced sensors.
